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Screencast Apk Full Cracked Software


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Free screen recorder for Windows, Mac and Linux. With Screencast you can record the screen and audio at the same time. Cinelerra Screencast Free is a screen recording software designed for free. In addition to recording the screen, it will also record your audio, your microphone and your webcam if you have one.1. Field of the Invention The present invention relates to a method of manufacturing a semiconductor device which requires a heat treatment. 2. Description of the Related Art Silicon wafers are widely used as substrates for semiconductor devices. A plurality of circuits each having a device such as a transistor are formed on a surface of the silicon wafer. The circuits are connected with each other to realize a predetermined function. If the function of the circuits is improved and the semiconductor device is miniaturized, it is necessary to reduce the size of the circuits. However, miniaturization of the circuits is limited by the thickness of the silicon wafer. Therefore, in the existing circumstance, the size of the circuits has to be reduced by reducing the thickness of the silicon wafer to about 100 μm. In order to reduce the thickness of the silicon wafer, it is necessary to reduce the thickness of the device and increase the size of the circuits. Thus, it is necessary to reduce the thickness of the circuits formed on the silicon wafer. The thickness of the circuit can be reduced by thinning the gate insulating film on the gate electrode of the transistor in the circuit. However, thinning the gate insulating film causes deterioration of the electrical characteristics of the transistor in the circuit, resulting in reduction of the operational stability of the circuit. In order to maintain the characteristics of the transistor in the circuit, it is necessary to increase the thickness of the gate insulating film in the circuit. It is possible to increase the thickness of the gate insulating film by using a chemical vapor deposition method (CVD method) as a method of forming the gate insulating film. However, in the CVD method, the film is deposited on the entire surface of the silicon wafer, causing a problem in that the manufacturing costs are increased. Thus, in recent years, a technique of forming a shallow trench isolation (STI) has been developed as a technique for reducing the size of the circuits (see, for example, Jpn. Pat. Appln. KOKAI Publication No. 2003-205266). The STI is formed by etching a part




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Screencast Apk Full Cracked Software

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